BERGQUIST® GAP FILLER TGF 1000SR
Známé jako Gap Filler 1000SR
Vlastnosti a výhody
This 2-part, silicone-based, thermally conductive, liquid gap-filling material has excellent slump resistance (stays in place). It’s ideal for use in automotive electronics applications.
BERGQUIST® GAP FILLER TGF 1000SR is a 2-part, silicone based, thermally conductive liquid gap-filling material that features superior slump resistance. The mixed system will cure at room temperature, or faster with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies and capable of filling unique and intricate air voids and gaps. It has excellent low- and high-temperature mechanical and chemical stability, and is intended for use in automotive electronics applications.
Oblasti Použití
Dokumenty ke stažení
Hledáte TS nebo BL v jiném jazyce?
Další dokumenty
Technické informace
| Hodnocení hořlavosti | V-0 |
| Provozní teplota | -60.0 - 175.0 °C |
| Tepelná vodivost | 0.1 W/mK |
| Způsob vytvrzování | Vytvrzování teplem |
| Tužidlo | |
| Barva, Tužidlo | Bílá |
BERGQUIST® GAP FILLER TGF 1000SR
This 2-part, silicone-based, thermally conductive, liquid gap-filling material has excellent slump resistance (stays in place). It’s ideal for use in automotive electronics applications.