LOCTITE® ABLESTIK 2053S
Known as ABLEBOND 2053S (10G)
Features and Benefits
This red, non-conductive die-attach adhesive is designed for flex, laminate and die-to-die.
LOCTITE® ABLESTIK 2053S is a polymer-filled, hybrid, non-conductive die-attach adhesive for array packaging. It's typically used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, and as a receiver and die-attach for 3D sensing modules. It's proven effective on various substrates, such as EMC, engineering plastic, glass and metals, and offers low warpage, stress and moisture uptake. It s a low-modulus adhesive, making it ideal for wire bonding small die sizes and chip bonding on FR4 substrates. It cures when exposed to heat.
- Low-stress
- Non-conductive
- Low moisture uptake
- Multi-substrate
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 149.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 216.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Glass transition temperature (Tg) | -21.0 °C |
| Hot die shear strength | 2.1 kg-f |
| RT die shear strength | 6.0 kg-f |
| Tensile modulus, @ 250.0 °C | 22.0 N/mm² (3200.0 psi ) |
| Thixotropic index | 2.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 130000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2053S
This red, non-conductive die-attach adhesive is designed for flex, laminate and die-to-die.