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Henkel Adhesive Technologies
Thermally conductive adhesives
LOCTITE® 315
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Self-shimming, thermally conductive, controlled-strength activator-cured paste
LOCTITE® 384
Thermally conductive adhesive for bonding heat-generating electronic components
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP 1800
Electrically insulating, fibreglass-reinforced – exceptional performance
BERGQUIST® BOND PLY TBP 1400LMS-HD
Flexible, laminated material for structural component bonding
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 10000ULM
Soft, electrically insulating pad with exceptional thermal conductivity
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3600
Versatile, high-performance dispensable liquid
BERGQUIST® TGF 3010APS
High performance dispensable liquid for e-Mobility battery applications
BERGQUIST® SIL PAD® TSP 1600S
Electrically insulating pad – general purpose
BERGQUIST® GAP PAD® TGP 12000ULM
Extremely soft electrically insulating pad with exceptional thermal conductivity
BERGQUIST® SIL PAD® TSP K1300
Electrically insulating, polyimide-reinforced pad – high performance
BERGQUIST® GAP PAD® TGP 1000VOUS
Ultra soft, fibreglass-reinforced insulation pad – high voltage applications
Thermal gels
BERGQUIST® LIQUI FORM TLF 6000HG
For telecom market applications requiring high gap fill