BERGQUIST® GAP FILLER TGF 1000SR
Poznat kao Gap Filler 1000SR
Elementi i pogodnosti
This 2-part, silicone-based, thermally conductive, liquid gap-filling material has excellent slump resistance (stays in place). It’s ideal for use in automotive electronics applications.
BERGQUIST® GAP FILLER TGF 1000SR is a 2-part, silicone based, thermally conductive liquid gap-filling material that features superior slump resistance. The mixed system will cure at room temperature, or faster with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies and capable of filling unique and intricate air voids and gaps. It has excellent low- and high-temperature mechanical and chemical stability, and is intended for use in automotive electronics applications.
Pročitajte više
Dokumenti i preuzimanja
Tražite tehničke listove ili bezbednosne listove na drugom jeziku?
Dodatna dokumenta
Tehnički podaci
| Otpornost na plamen | V-0 |
| Radna temperatura | -60.0 - 175.0 °C |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Toplotna provodljivost | 0.1 W/mK |
| Učvršćivač | |
| Boja, Učvršćivač | Bela |
BERGQUIST® GAP FILLER TGF 1000SR
This 2-part, silicone-based, thermally conductive, liquid gap-filling material has excellent slump resistance (stays in place). It’s ideal for use in automotive electronics applications.