BERGQUIST® LIQUI BOND TLB SA2000
Features and Benefits
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This 1-part, silicone liquid adhesive maintains a solid structural bond and thermal conductivity in severe environment applications.
BERGQUIST® LIQUI BOND TLB SA2000 is high performance and thermally conductive, and has excellent low- and high-temperature mechanical and chemical stability, replacing the need for mechanical fasteners. The heat curable product is offered in a 1-part formulation for easy dispensing, and is supplied in either a tube or mid-sized container. Typical applications include attaching PCBA to housing and discrete component to heat spreader.
- High thermal conductivity: 2.0 W/m-K
- Excellent mechanical and chemical stability
- Eliminates the need for mechanical fasteners
- 1-part: no mixing required
Documents and Downloads
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Additional Documents
Technical Information
| Color | Yellow |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 2.0 W/mK |
BERGQUIST® LIQUI BOND TLB SA2000
This 1-part, silicone liquid adhesive maintains a solid structural bond and thermal conductivity in severe environment applications.