BERGQUIST® LIQUI FORM TLF 6000HG
Características y Ventajas
This 1-part, gray, silicone-based, fully cured thermal interface gel is specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.
BERGQUIST® LIQUI FORM TLF 6000HG is an award-winning, thermally conductive, dispensable, highly conformable thermal interface gel that provides electronic component thermal management capability within remote antennas and 5G base stations. It is ideal for filling larger gaps that measure up to 3.0 mm (0.11"), delivering robust vertical gap stability.
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Información técnica
| Conductividad térmica | 6.0 W/mK |
| Resistencia a la flama | V-0 |
| Temperatura de funcionamiento | -60.0 - 200.0 °C |
| Vida útil de almacenamiento, @ 25.0 | 365.0 día |
BERGQUIST® LIQUI FORM TLF 6000HG
This 1-part, gray, silicone-based, fully cured thermal interface gel is specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.