TECHNOMELT® PA 2302 BLACK
Features and Benefits
A 1-part, low-viscosity, thermoplastic hot melt adhesive specially designed for moulding applications.
TECHNOMELT® PA 2302 BLACK is a 1-part polyamide hot melt adhesive formulated for moulding processes. Its low viscosity makes it ideal for encapsulating fragile components without damage. Once applied, it solidifies to form a barrier between electronics and the environment. Ideal for potting electronics modules, moulding strain relief into wiring, and encapsulation of sensors. A versatile adhesive for a variety of substrates.
- 1 part: no mixing required
- Low viscosity
- Moulding temperature 220°C to 240°C (428°F to 464°F)
- Easy mouldability
Documents and Downloads
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Technical Information
| Applications | Encapsulating |
| Colour | Black |
| Number of components | 1 part |
TECHNOMELT® PA 2302 BLACK
A 1-part, low-viscosity, thermoplastic hot melt adhesive specially designed for moulding applications.