BERGQUIST® GAP FILLER TGF 1000SR
Connu sous le nom de Gap Filler 1000SR
Caractéristiques et avantages
This 2-part, silicone-based, thermally conductive, liquid gap-filling material has excellent slump resistance (stays in place). It’s ideal for use in automotive electronics applications.
BERGQUIST® GAP FILLER TGF 1000SR is a 2-part, silicone based, thermally conductive liquid gap-filling material that features superior slump resistance. The mixed system will cure at room temperature, or faster with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies and capable of filling unique and intricate air voids and gaps. It has excellent low- and high-temperature mechanical and chemical stability, and is intended for use in automotive electronics applications.
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Informations techniques
| Conductivité thermique | 0.1 W/mK |
| Cote d'inflammabilité | V-0 |
| Température de service | -60.0 - 175.0 °C |
| Type de polymérisation | Polymérisation par la chaleur |
| Durcisseur | |
| Couleur, Durcisseur | Blanc |
BERGQUIST® GAP FILLER TGF 1000SR
This 2-part, silicone-based, thermally conductive, liquid gap-filling material has excellent slump resistance (stays in place). It’s ideal for use in automotive electronics applications.